Flow & Methodology Developer for Mixed signal/RFIC die and package design

In this job you will drive the development, testing and maintaining of state-of-the-art IC-package co-design tool and flow. You will be working within the department of Design Enablement Engineering Support and in close collaboration with RF-EM Design Enablement department in NXP CTO. The work is performed in close co-operation with the back-end design team, package […]