Highest Power Density for 650V IGBT in Surface Mounting D2PAK

By Zulkarnain/ Updated On Tue, May 29th, 2018

The new product family is offering up to 40 A 650V IGBT, co-packed with a full rated 40 A diode in a surface mounting TO-263-3 also known as D2PAK.

To expand its market and product portfolio, Infineon Technologies has expanded with introducing thin-wafer technology TRENCHSTOP5 IGBT.

The new product family is offering up to 40 A 650V IGBT, co-packed with a full rated 40 A diode in a surface mounting TO-263-3 also known as D2PAK.

The introduction of TRENCHSTOP 5 IGBT in D2PAK package will serve a growing demand for higher power density in power devices for automated surface mounted assembly. The product can be used in applications that require highest power density and efficiency. Those include solar inverters, uninterruptible power supply (UPS), battery charging, and energy storage.

The company is the first to fit a 40 A 650V IGBT together with a 40 A diode in D2PAK housing. It will also help in allowing higher power destiny in a smaller chip size.

With other co-packed solutions delivering only 75% of the power the new product by the company offers a higher rating than any other product in the market.

The high power density of the new devices enable designers to upgrade existing designs, develop new platforms with up to 25% higher power output or to reduce the quantity of power devices used in parallel and thus allowing more compact designs.

The unique co-packed 40 A in D2PAK can be considered as an alternative to D3PAK or TO-247 used for surface mounting. This supports easy soldering, leading to fast and reliable assembly.

The product family comprises 15 A, 20 A, 30 A single IGBT and 15 A, 20 A, 30 A and 40 A IGBT co-packed with the same current freewheeling diode.

Infineon at the PCIM 2018

At the PCIM 2018 tradeshow Infineon is presenting leading edge technology for efficient systems in industrial, consumer and automotive applications. Infineon’s demos for empowering a world of unlimited energy are presented at booth #412 in hall 9 (Nuremberg, Germany, 5-7 June 2018).